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Category:Semiconductor packages

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Engineering portal

Here is a list of articles in the Semiconductor packages category of the Engineering portal. Pertains to the various enclosures used to package semiconductor devices.

Subcategories

This category has only the following subcategory.

C

  • Chip carriers (38 P)

Pages in category "Semiconductor packages"

The following 20 pages are in this category, out of 20 total.

 

  • Engineering:Semiconductor package

D

  • Engineering:DO-204
  • Engineering:DO-214

I

  • Engineering:List of integrated circuit packaging types

M

  • Engineering:Metal electrode leadless face
  • Engineering:Mini Small Outline Package

S

  • Engineering:Single Chip Module
  • Engineering:Single-Chip Module
  • Engineering:Small-outline transistor

T

  • Engineering:Thin shrink small outline package
  • Engineering:TO-3
  • Engineering:TO-18
  • Engineering:TO-92
  • Engineering:TO-126
  • Engineering:TO-220
  • Engineering:TO-252
  • Engineering:TO-263
  • Engineering:TO-5
  • Engineering:TO-66

U

  • Engineering:Ultraviolet thermal processing
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              • This page was last edited on 28 February 2021, at 17:02.
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