| Display title | Engineering:Thermally Advantaged Chassis |
| Default sort key | Thermally Advantaged Chassis |
| Page length (in bytes) | 2,635 |
| Namespace ID | 3034 |
| Namespace | Engineering |
| Page ID | 313562 |
| Page content language | en - English |
| Page content model | wikitext |
| Indexing by robots | Allowed |
| Number of redirects to this page | 0 |
| Counted as a content page | Yes |
| HandWiki item ID | None |
| Edit | Allow all users (infinite) |
| Move | Allow all users (infinite) |
| Page creator | imported>ScienceGen |
| Date of page creation | 20:58, 11 November 2023 |
| Latest editor | imported>ScienceGen |
| Date of latest edit | 20:58, 11 November 2023 |
| Total number of edits | 1 |
| Recent number of edits (within past 90 days) | 0 |
| Recent number of distinct authors | 0 |
Description | Content |
Article description: (description)
This attribute controls the content of the description and og:description elements. | A Thermally Advantaged Chassis (TAC) is a computer enclosure that complies with the Thermally Advantaged Chassis specifications created by Intel. It is capable of maintaining an internal ambient temperature below 38 degrees Celsius when functioning with Intel's Pentium 4 and Celeron D processors based... |
