| Display title | Engineering:Potting (electronics) |
| Default sort key | Potting (electronics) |
| Page length (in bytes) | 4,690 |
| Namespace ID | 3034 |
| Namespace | Engineering |
| Page ID | 728634 |
| Page content language | en - English |
| Page content model | wikitext |
| Indexing by robots | Allowed |
| Number of redirects to this page | 1 |
| Counted as a content page | Yes |
| Page image |  |
| HandWiki item ID | None |
| Edit | Allow all users (infinite) |
| Move | Allow all users (infinite) |
| Page creator | imported>Rtexter1 |
| Date of page creation | 16:06, 25 June 2023 |
| Latest editor | imported>Rtexter1 |
| Date of latest edit | 16:06, 25 June 2023 |
| Total number of edits | 1 |
| Recent number of edits (within past 90 days) | 0 |
| Recent number of distinct authors | 0 |
Description | Content |
Article description: (description)
This attribute controls the content of the description and og:description elements. | In electronics, potting is a process of filling a complete electronic assembly with a solid or gelatinous compound for high voltage assemblies by excluding gaseous phenomena such as corona discharge, for resistance to shock and vibration, and for the exclusion of water, moisture, or corrosive agents... |
