| Display title | Engineering:Microvia |
| Default sort key | Microvia |
| Page length (in bytes) | 10,115 |
| Namespace ID | 3034 |
| Namespace | Engineering |
| Page ID | 430680 |
| Page content language | en - English |
| Page content model | wikitext |
| Indexing by robots | Allowed |
| Number of redirects to this page | 0 |
| Counted as a content page | Yes |
| HandWiki item ID | None |
| Edit | Allow all users (infinite) |
| Move | Allow all users (infinite) |
| Page creator | imported>Scavis |
| Date of page creation | 21:53, 26 June 2023 |
| Latest editor | imported>Scavis |
| Date of latest edit | 21:53, 26 June 2023 |
| Total number of edits | 1 |
| Recent number of edits (within past 90 days) | 0 |
| Recent number of distinct authors | 0 |
Description | Content |
Article description: (description)
This attribute controls the content of the description and og:description elements. | Microvias are used as the interconnects between layers in high density interconnect (HDI) substrates and printed circuit boards (PCBs) to accommodate the high input/output (I/O) density of advanced packages. Driven by portability and wireless communications, the electronics industry strives to produce... |
