Information for "Engineering:Lead frame"

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Display title	Engineering:Lead frame
Default sort key	Lead frame
Page length (in bytes)	2,984
Namespace ID	3034
Namespace	Engineering
Page ID	191314
Page content language	en - English
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Page creator	imported>TextAI2
Date of page creation	14:46, 4 February 2024
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Date of latest edit	14:46, 4 February 2024
Total number of edits	1
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Description	Content
Article description: (`description`) This attribute controls the content of the `description` and `og:description` elements.	A lead frame (pronounced LEED) is a metal structure inside a chip package that carries signals from the die to the outside, used in DIP, QFP and other packages where connections to the chip are made on its edges. The lead frame consists of a central die pad, where the die is placed, surrounded by...

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