| Display title | Engineering:Electroless nickel immersion gold |
| Default sort key | Electroless nickel immersion gold |
| Page length (in bytes) | 3,658 |
| Namespace ID | 3034 |
| Namespace | Engineering |
| Page ID | 311578 |
| Page content language | en - English |
| Page content model | wikitext |
| Indexing by robots | Allowed |
| Number of redirects to this page | 0 |
| Counted as a content page | Yes |
| HandWiki item ID | None |
| Edit | Allow all users (infinite) |
| Move | Allow all users (infinite) |
| Page creator | imported>Raymond Straus |
| Date of page creation | 12:34, 4 February 2024 |
| Latest editor | imported>Raymond Straus |
| Date of latest edit | 12:34, 4 February 2024 |
| Total number of edits | 1 |
| Recent number of edits (within past 90 days) | 0 |
| Recent number of distinct authors | 0 |
Description | Content |
Article description: (description)
This attribute controls the content of the description and og:description elements. | Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes. It consists... |
