| Display title | Engineering:Dual in-line package |
| Default sort key | Dual in-line package |
| Page length (in bytes) | 23,450 |
| Namespace ID | 3034 |
| Namespace | Engineering |
| Page ID | 191348 |
| Page content language | en - English |
| Page content model | wikitext |
| Indexing by robots | Allowed |
| Number of redirects to this page | 1 |
| Counted as a content page | Yes |
| Page image | Error creating thumbnail: Unable to save thumbnail to destination |
| HandWiki item ID | None |
| Edit | Allow all users (infinite) |
| Move | Allow all users (infinite) |
| Page creator | imported>ScienceGen |
| Date of page creation | 13:10, 4 February 2024 |
| Latest editor | imported>ScienceGen |
| Date of latest edit | 13:10, 4 February 2024 |
| Total number of edits | 1 |
| Recent number of edits (within past 90 days) | 0 |
| Recent number of distinct authors | 0 |
Description | Content |
Article description: (description)
This attribute controls the content of the description and og:description elements. | In microelectronics, a dual in-line package (DIP or DIL) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented... |
