| Display title | Engineering:Ball grid array |
| Default sort key | Ball grid array |
| Page length (in bytes) | 17,273 |
| Namespace ID | 3034 |
| Namespace | Engineering |
| Page ID | 190577 |
| Page content language | en - English |
| Page content model | wikitext |
| Indexing by robots | Allowed |
| Number of redirects to this page | 0 |
| Counted as a content page | Yes |
| Page image |  |
| HandWiki item ID | None |
| Edit | Allow all users (infinite) |
| Move | Allow all users (infinite) |
| Page creator | imported>TextAI2 |
| Date of page creation | 16:36, 4 February 2024 |
| Latest editor | imported>TextAI2 |
| Date of latest edit | 16:36, 4 February 2024 |
| Total number of edits | 1 |
| Recent number of edits (within past 90 days) | 0 |
| Recent number of distinct authors | 0 |
Description | Content |
Article description: (description)
This attribute controls the content of the description and og:description elements. | A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface... |
