View source for Chemistry:Vespel

[[File:Poly-oxydiphenylene-pyromellitimide.svg|thumb|Structure of a Vespel [[Chemistry:Polymer|polymer]]]]
[[File:Vespel.Werkstueck.P1149524.jpg|thumb|Sawn and turned workpiece made from Vespel]]

'''Vespel''' is the trademark of a range of durable high-performance [[Chemistry:Polyimide|polyimide]]-based [[Chemistry:Plastic|plastic]]s made by [[Company:DuPont|DuPont]].<ref>{{Cite web|last=admin|title=Polyimide {{!}} Vespel - SPN expert en plastiques hautes performances|url=https://www.plastiques-nobles.com/en/polyimide-vespel-3/|access-date=2022-02-17|website=Plastiques SPN|language=fr-FR}}</ref><ref>{{Cite patent|number=US3425865A|title=Insulated conductor|gdate=1969-02-04|inventor1-first=Charles F.|inventor1-last=Shelton|url=https://patents.google.com/patent/US3425865A/en}}</ref>

== Characteristics and applications ==
Vespel is mostly used in [[Earth:Aerospace|aerospace]], [[Physics:Semiconductor|semiconductor]], and transportation technology.  It combines heat resistance, lubricity, dimensional stability, chemical resistance, and creep resistance, and can be used in hostile and extreme environmental conditions.

Unlike most plastics,<ref>{{Cite journal |last=Schmidtchen |first=U. |last2=Gradt |first2=T. |last3=Börner |first3=H. |last4=Behrend |first4=E. |date=1994-02-01 |title=Temperature behaviour of permeation of helium through Vespel and Torlon |url=https://www.sciencedirect.com/science/article/pii/0011227594900329 |journal=Cryogenics |volume=34 |issue=2 |pages=105–109 |doi=10.1016/0011-2275(94)90032-9 |issn=0011-2275}}</ref> it does not produce significant [[Physics:Outgassing|outgassing]] even at high temperatures, which makes it useful for lightweight heat shields and [[Crucible|crucible]] support. It also performs well in [[Physics:Vacuum|vacuum]] applications,<ref>{{Cite journal |last=Murari |first=A. |last2=Vinante |first2=C. |last3=Monari |first3=M. |date=2002-04-19 |title=Comparison of PEEK and VESPEL®SP1 characteristics as vacuum seals for fusion applications |url=https://www.sciencedirect.com/science/article/pii/S0042207X01004201 |journal=Vacuum |series=IUVSTA Highlights Seminar |volume=65 |issue=2 |pages=137–145 |doi=10.1016/S0042-207X(01)00420-1 |issn=0042-207X}}</ref> down to extremely low cryogenic temperatures. However, Vespel tends to absorb a small amount of water, resulting in longer pump time while placed in a vacuum.

Although there are polymers surpassing polyimide in each of these properties, the combination of them is the main advantage of Vespel.

== Thermophysical properties ==
Vespel is commonly used as a [[Physics:Thermal conductivity|thermal conductivity]] [[Chemistry:Certified reference materials|reference material]] for testing thermal insulators, because of high [[Reproducibility|reproducibility]] and consistency of its [[Physics:Thermodynamics|thermophysical properties]]. For example, it can withstand repeated heating up to 300 [[Celsius|°C]] without altering its thermal and mechanical properties.{{cn|date=November 2019}} Extensive tables of measured [[Physics:Thermal diffusivity|thermal diffusivity]], [[Physics:Specific heat capacity|specific heat capacity]], and derived [[Physics:Density|density]], all as  functions of [[Physics:Temperature|temperature]], have been published.{{cn|date=November 2019}}

== Magnetic properties ==
Vespel is used in high-resolution probes for NMR spectroscopy because its [[Physics:Magnetic susceptibility|volume magnetic susceptibility]] (−9.02 ± 0.25×10<sup>−6</sup> for Vespel SP-1 at 21.8&nbsp;°C<ref>{{cite journal
|author1=P. T. Keyser  |author2=S. R. Jefferts
 |name-list-style=amp | title = Magnetic Susceptibility of Some Materials Used for Apparatus Construction (at 295 K)
| year = 1989| journal = Rev. Sci. Instrum.| volume = 60
| issue = 8| pages = 2711–2714| doi = 10.1063/1.1140646|bibcode=1989RScI...60.2711K
 | doi-access = free}}</ref>) is close to that of [[Chemistry:Water|water]] at [[Physics:Room temperature|room temperature]] (−9.03×10<sup>−6</sup> at 20&nbsp;°C <ref>{{cite journal
| author = A. Carlsson, G. Starck, M. Ljungberg, S. Ekholm and E. Forssell-Aronsson
| title = Accurate and sensitive measurements of magnetic susceptibility using echo planar imaging
| year = 2006| journal = Magn. Reson. Imaging| volume = 24
| issue = 9| pages = 1179–1185| doi = 10.1016/j.mri.2006.07.005| pmid = 17071340}}</ref>)  Negative values indicate that both substances are diamagnetic. Matching volume magnetic susceptibilities of materials surrounding NMR sample to that of the [[Physics:Solvent|solvent]] can reduce susceptibility broadening of magnetic resonance lines.

== Processing for manufacturing applications ==
Vespel can be processed by direct forming (DF) and isostatic molding (basic shapes – plates, rods and tubes).  For prototype quantities, basic shapes are typically used for cost efficiency since tooling is quite expensive for DF parts.  For large scale CNC production, DF parts are often used to reduce per part costs, at the expense of [[Physics:Material|material]] properties which are inferior to those of isostatically produced basic shapes.<ref>{{cite web|title=Tamshell Materials|url=https://tamshell.com/materials-list|access-date=22 September 2017}}</ref>

== Types ==
For different applications, special formulations are blended/compounded. Shapes are produced by three standard processes: 
# compression molding (for plates and rings);
# isostatic molding (for rods); and
# direct forming (for small size parts produced in large volumes).

Direct-formed parts have lower performance characteristics than parts that have been machined from compression-molded or isostatic shapes.  Isostatic shapes have isotropic physical properties, whereas direct formed and compression molded shapes exhibit anisotropic physical properties.

Some examples of standard polyimide compounds are:
; [https://www.professionalplastics.com/VESPELSP1-DUPONT SP-1 virgin polyimide]: provides operating temperatures from cryogenic to 300&nbsp;°C (570&nbsp;°F), high [[Physics:Plasma|plasma]] resistance, as well as a UL rating for minimal electrical and thermal conductivity. This is the unfilled base polyimide resin. It also provides high physical strength and maximal elongation, and the best electrical and thermal insulation values. Example: Vespel SP-1.
; 15% graphite by weight, SP-21: added to the base resin for increased wear resistance and reduced [[Physics:Friction|friction]] in applications such as [[Engineering:Plain bearing|plain bearing]]s, thrust washers, seal rings, slide blocks and other wear applications. This compound has the best mechanical properties of the graphite-filled grades, but lower than the virgin grade. Example: [https://www.professionalplastics.com/VESPELSP21-DUPONT Vespel SP-21].
; 40% graphite by weight, SP-22: for enhanced wear resistance, lower friction, improved dimensional stability (low coefficient of [[Physics:Thermal expansion|thermal expansion]]), and stability against oxidation. Example: [https://www.professionalplastics.com/VESPELSP22-DUPONT Vespel SP-22].
; 10% PTFE and 15% graphite by weight, SP-211: added to the base resin for the lowest coefficient of friction over a wide range of operating conditions. It also has excellent wear resistance up to 149&nbsp;°C (300&nbsp;°F). Typical applications include sliding or linear [[Physics:Bearing (mechanical)|bearings]] as well as many wear and friction uses listed above. Example: [https://www.professionalplastics.com/VESPELSP211-DUPONT Vespel SP-211].
; 15% moly-filled (molybdenum disulfide solid lubricant), SP-3: for wear and friction resistance in vacuum and other moisture-free environments where graphite actually becomes abrasive. Typical applications include seals, plain bearings, [[Physics:Gear|gear]]s, and other wear surfaces in outer space, ultra-high vacuum or dry gas applications. Example: [https://www.professionalplastics.com/VESPEL-SP3-DUPONT Vespel SP-3].

== Material properties data ==
{| class="wikitable"
|+ Material properties of Vespel<ref>[https://web.archive.org/web/20070221055253/http://www2.dupont.com/Vespel/en_US/Literature/sp1.pdf Summary of typical properties standard SP polyimide resins]. DuPont</ref> (produced by isostatic molding and machining)
! Property
! Units
! Test <br/>condition
! SP-1 <br/>(unfilled)
! SP-21 <br/>(15% graphite)
! SP-22 <br/>(40% graphite)
! SP-211 <br/>(10% PTFE, <br/>15% graphite)
! SP-3 <br/>(15% {{chem|Mo|S|2}})
|-
| [[Physics:Specific gravity|Specific gravity]] || dimensionless||  ||1.43||1.51||1.65||1.55||1.60
|-
| rowspan=2 | Thermal expansion <br/>coefficient
| rowspan=2 | 10<sup>−6</sup>/[[Kelvin (unit)|K]]
| 211–296 K || 45 || 34 || 27 <ref>{{deadlink|date=October 2020}}http://www2.dupont.com/Vespel/en_US/assets/downloads/vespel_s/Vespel_SP-22_DF.pdf</ref>|| ||
|-
| 296–573 K || 54 || 49 || 38 || 54 || 52
|-
| Thermal conductivity || W/mK || at 313 K || 0.35 || 0.87 || 1.73 || 0.76 || 0.47
|-
| Volume resistivity || Ω·m || at 296 K || 10<sup>14</sup>–10<sup>15</sup> || 10<sup>12</sup>–10<sup>13</sup> || || ||
|-
| rowspan=3 | Dielectric constant
| rowspan=3 | dimensionless
| at 100&nbsp;Hz || 3.62 || 13.53 || || ||
|-
| at 10&nbsp;kHz || 3.64 || 13.28 || || ||
|-
| at 1&nbsp;MHz || 3.55 || 13.41 || || ||
|}

==References==
{{reflist}}
[[Category:Plastics]]

{{Sourceattribution|Vespel}}